Wire Processing and Electrical Installation Equipment

BGA Solder Balls 0.25-0.76mm Leaded Tin - Rework Repair Tool Reballing 25K/Bottle

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Description

25K/Bottle BGA Solder Ball 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm Leaded Tin BGA Rework Repair Tool Reballing ReapirFeatures:1.Solder (Tin) paste is the best choice of reballing IC.2.It is used instead of the pin in the IC component package structure.3.Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.Brand new and high quality.Tin ball: 0.76, 0.65,0.6, 0.55, 0.5, 0.45, 0.40, 0.35, 0.3, 0.25MMColor:As pictureBalls Alloy: Sn63/Pb37Standard: RoHs Available & SGS TestedQuantity:25000pcs/bottlePackage Include:25000pcs/bottleNotice:1.1cm=10mm=0.39inch.2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.3.Please understand that colors may exist chromatic aberration as the...

Specifications

Certification
CE
Model
25K/Bottle BGA Solder Ball
Model Number
BGA Solder Ball 0.2-0.76MM
Origin
Mainland China
Particle Size
1-10μm
Application for BGA Solder Balls 0.25-0.76mm Leaded Tin - Rework Repair Tool Reballing 25K/Bottle